Characterization methods for fine copper wire

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The paper identifies and describes the methodology developed and utilized for the characterization of fine copper wire. Specifically, techniques for characterizing mechanical strength, elongation, springback, spiral elongation, conductivity (resistivity), and texture of 32 AWG are presented.

Description

The paper identifies and describes the methodology developed and utilized for the characterization of fine copper wire. Specifically, techniques for characterizing mechanical strength, elongation, springback, spiral elongation, conductivity (resistivity), and texture of 32 AWG are presented.

Additional information

Author(s)

Susan S. Enos and Sharon K. Young, BHP Copper, Inc., USA

Publication/Event/Pages

Paper presented at WAI 66th Annual Convention, Charlotte, NC USA. Paper published in Wire Journal International, August 1997, pg. 74.

Year

1996