$15.00
The paper covers the following subject areas: die nomenclature—determining meeting point diameters; die design—selecting the correct contact point in the approach angle relating to drafting and reduction in area per pass; double angle draw die—special applications; measuring the die—profilometer and data analysis equipment; and pressure coating device—extended die life and production.
The paper covers the following subject areas: die nomenclature—determining meeting point diameters; die design—selecting the correct contact point in the approach angle relating to drafting and reduction in area per pass; double angle draw die—special applications; measuring the die—profilometer and data analysis equipment; and pressure coating device—extended die life and production.
| Author(s) | Thomas Maxwell, Die Quip Corp., USA, and Francisco Rodriguez Pacheco, Diamantes Mexicanos, S.A. de C.V., Mexico |
|---|---|
| Publication/Event/Pages | Paper presented at WAI International Technical Conference, Mexico City, Mexico. Paper published in Wire Journal International, May 2001, pg. 72. |
| Year | 2000 |
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