Description

Traditionally, soluble anodes are used for most wire-plating operations; the metal is anodically dissolved into the electrolyte and subsequently plated onto the wire. There are many deficiencies to this approach, including downtime to replenish the anode, variation in anode to cathode gap, poor current distribution due to high contact resistance and higher power consumption. Replacement of soluble or lead anodes with titanium substrates coated with mixed metal oxides provides wire platers with the opportunity to improve overall operating economics.