Growth and disappearance of flaws on wire surface in wiredrawing

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Using three-dimensional FEA, this study investigates growth of flaws on the surface due to wiredrawing and the influence of inclusions when these are located away from the center of the wire on wire breaks. Wire breaks due to surface flaws and inclusions are common problems in super fine wiredrawing.

Description

Using three-dimensional FEA, this study investigates growth of flaws on the surface due to wiredrawing and the influence of inclusions when these are located away from the center of the wire on wire breaks. Wire breaks due to surface flaws and inclusions are common problems in super fine wiredrawing.

Additional information

Author(s)

Kazunari Yoshida and Tetsuo Shinohara, Tokai University, Japan.

Publication/Event/Pages

Paper presented at WAI 71st Annual Convention, Atlanta, GA USA. Paper published in Wire Journal International, Dec. 2004, pg. 52.

Year

2003