Effect of die semi-angle and multi-pass drawing on additional shear strain layer

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The hardened layer at the surface of fine-drawn wire, the additional shear strain layer, is around 0.04 mm in depth and is generated by the friction between dies and wire. The main purpose of this paper is to clarify the tensile strength and microstructure of the additional shear strain layer. It was found that the layer is hardened in drawing with a low semi-angle die. It was also found that there is a correlation between an increase in tensile strength and the subdivisions of crystal grains in the additional shear strain layer.

SKU: P05289 Category:

Description

The hardened layer at the surface of fine-drawn wire, the additional shear strain layer, is around 0.04 mm in depth and is generated by the friction between dies and wire. The main purpose of this paper is to clarify the tensile strength and microstructure of the additional shear strain layer. It was found that the layer is hardened in drawing with a low semi-angle die. It was also found that there is a correlation between an increase in tensile strength and the subdivisions of crystal grains in the additional shear strain layer.

Additional information

Author(s)

Kazuki Hosoda, Motoo Asakawa, Satoshi Kajino, and Y. Maeda, Waseda University, Japan

Publication/Event/Pages

Paper presented at WAI's 77th Annual Convention (Interwire) in Cleveland, May, 2007. Published in WJI, November 2008, pp. 68-73.

Year

2007