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$Development of fracture prediction technology during Cu fine-wire drawing$
Development of fracture prediction technology during Cu fine-wire drawing
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Drawing stainless steel microwire of 400 to 600 µm
$15.00 Add to cart
Physical conditions in the lubricant layer
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Texture development in copper wire
$15.00 Add to cart

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The Wire Association International, Inc.
71 Bradley Road, Suite 9
Madison, CT 06443-2662

The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.

Development of fracture prediction technology during Cu fine-wire drawing

Drawing stainless steel microwire of 400 to 600 µm

Physical conditions in the lubricant layer

Texture development in copper wire

Quick Links

Contact Us