Description

This document is a technical paper commemorating wire-drawing pioneers A.B. Dove and H.J. Godfrey. It reviews their contributions to wire drawing technology, including advancements in steelmaking and die design. The paper also examines the application of computer simulation using finite element analysis (FEA) to optimize wire drawing processes. The FEA analysis investigates the effects of die angle, approach geometry, and coefficient of friction on stress distribution during wire drawing. Finally, statistical methods, such as Design of Experiments (DOE), are employed to analyze the simulation results and determine optimal die design parameters.

The author of this paper is RM Shemanski. The presentation was given in Cleveland, OH in 1998. The paper is also dedicated to the memory of John Mordica, the Founding President of the Wire Association International.