Analysis of tin-and nickel-plated copper wire failures for quality improvement

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Failure analysis is an important tool in wiredrawing quality improvement. Certain aspects of wire failures occurring in plated wires are specific to the particular type of plating that is being used. This paper examines some of the wire failure concepts for tin- and nickel-plated copper wire. Some of the characteristics of tin- and nickel plating will be discussed and their implications on the wiredrawing operation will be presented.

Description

Failure analysis is an important tool in wiredrawing quality improvement. Certain aspects of wire failures occurring in plated wires are specific to the particular type of plating that is being used. This paper examines some of the wire failure concepts for tin- and nickel-plated copper wire. Some of the characteristics of tin- and nickel plating will be discussed and their implications on the wiredrawing operation will be presented.

Additional information

Author(s)

Masoud Garshasb, Phelps Dodge Copper Products Company, USA.

Publication/Event/Pages

Paper presented at WAI 71st Annual Convention, Atlanta, GA USA. Paper published in Wire Journal International, September 2002, pg. 86.

Year

2001