Characterization of rod and wire defects produced during the manufacturing of copper

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This paper covers the description of defects in copper wire which result from the melting and casting operation, rolling and pickling operation and entire wiredrawing operation (rod breakdown, intermediate and fine wiredrawing operation). The paper also describes the morphology of surface and subsurface defects produced by rolled-in oxides, and possible implications due to rod grain size and impurities present in the copper. The effect of trapped impurities during the cathode electrolytic process will be discussed as well as surface defects produced in the wire.

Description

This paper covers the description of defects in copper wire which result from the melting and casting operation, rolling and pickling operation and entire wiredrawing operation (rod breakdown, intermediate and fine wiredrawing operation). The paper also describes the morphology of surface and subsurface defects produced by rolled-in oxides, and possible implications due to rod grain size and impurities present in the copper. The effect of trapped impurities during the cathode electrolytic process will be discussed as well as surface defects produced in the wire.

Additional information

Author(s)

E. Henry Chia, American Fine Wire Corp.; and Gautam Patel, Georgia Institute of Technology, USA

Publication/Event/Pages

Paper presented at WAI 65th Annual Convention, Atlanta, GA USA. Paper published in Wire Journal International, June 1996, pg. 50.

Year

1995