Description
The internal stress and temperature distributions during wiredrawing and residual stress after the cooling of drawing temperature were simulated with FEM. The mean stress (hydrostatic stress) on the central axis of wire was found in various kinds of die semi-angle and reduction. The diagram of the mean stress on the die-wire contact length ratio to the diameter was found. The chevron crack existence condition was shown from the diagram to the die-wire contact length ratio when the tensile mean stress was the maximum value of the stress at 0.1 of the die-wire contact length ratio.
