Copper plating insoluble anode system for steel cord process: development of copper ion supply system

Copper plating insoluble anode system for steel cord process: development of copper ion supply system

$15.00

In the conventional method, the copper plates that serve as the anode change shape due to dissolution. This change causes the fluctuation of plating volume on the wires and the need for frequent adjustments to the position of the copper plates. To solve these problems, the new copper ion supply system has been developed. Two principal copper ion systems-the diaphragm system and oxygen system-will be explained. The oxygen system can generate copper ions as Cu + 1/2 02 + H20(r)Cu2 + 20H-, and control the concentration automatically by monitoring pH.

SKU: P04413 Category: Tags: , , ,

Description

In the conventional method, the copper plates that serve as the anode change shape due to dissolution. This change causes the fluctuation of plating volume on the wires and the need for frequent adjustments to the position of the copper plates. To solve these problems, the new copper ion supply system has been developed. Two principal copper ion systems-the diaphragm system and oxygen system-will be explained. The oxygen system can generate copper ions as Cu + 1/2 02 + H20(r)Cu2 + 20H-, and control the concentration automatically by monitoring pH.

Additional information

Author(s)

Masami Kikuchi, Haruo Nagaoka and Tadashi Nagasawa, Bridgestone Metalpha Corp., Japan.
Publication/Event/Pages

Paper presented at WAI 66th Annual Convention, Charlotte, NC USA. Paper published in Wire Journal International, August 1997, pg. 82.
Year

1996

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