$15.00
This paper discusses the stress in drawn wire after it leaves the drawing die and is coiled on the drawing drum. It demonstrates that the decisive influence on residual stress is exerted by non-uniform stress distribution formed in the die reduction angle and that the tension of the wire leads to the decrease in the residual stresses level. Further, it analyzes the stress distribution in the wire during elastoplastic tension.
This paper discusses the stress in drawn wire after it leaves the drawing die and is coiled on the drawing drum. It demonstrates that the decisive influence on residual stress is exerted by non-uniform stress distribution formed in the die reduction angle and that the tension of the wire leads to the decrease in the residual stresses level. Further, it analyzes the stress distribution in the wire during elastoplastic tension.
| Author(s) | Fryderyk Knap, Czestochowa Technical University, Poland |
|---|---|
| Publication/Event/Pages | Paper presented at WAI International Technical Conference, Montreal, Quebec, Canada |
| Year | 2002 |
The Wire Association International, Inc.
71 Bradley Road, Suite 9
Madison, CT 06443-2662
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
Copyright © 2025 The Wire Association International, Inc. All Rights Reserved
