$15.00
Studies on the effects of high temperature soldering on copper wire indicate that the life and diameter of small wire decreases with increased temperature, increased tin content of the solder reduces wire life, and the finer the wire size the shorter the wire life in the solder. Recommendations are made as to optimal soldering conditions for fine copper wire.
Studies on the effects of high temperature soldering on copper wire indicate that the life and diameter of small wire decreases with increased temperature, increased tin content of the solder reduces wire life, and the finer the wire size the shorter the wire life in the solder. Recommendations are made as to optimal soldering conditions for fine copper wire.
| Author(s) | Bailey, R.H., Fairchild Camera & Instrument Corp. |
|---|---|
| Publication/Event/Pages | Wire & Wire Products20(3): 197-199 1945 |
| Year | 1945 |
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The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
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