Development of an apparatus for determining the free tin thickness on tin-plated copper wire

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The presence of sufficient free tin on the wire surface is essential in terms of solderability and crimpability properties. Therefore, reliable measurement of free tin on finished products such as multiwire or stranded conductors is extremely important to meet both customer’s requirements and for controlling production costs. This paper describes the steps of development for a measurement device and related verification studies.

SKU: P05387 Category:

Description

The presence of sufficient free tin on the wire surface is essential in terms of solderability and crimpability properties. Therefore, reliable measurement of free tin on finished products such as multiwire or stranded conductors is extremely important to meet both customer’s requirements and for controlling production costs. This paper describes the steps of development for a measurement device and related verification studies.

Additional information

Author(s)

Sevim Özaltun and Serdar Karadeniz, Er-Bakir, Turkey

Publication/Event/Pages

Paper presented at WAI's International Technical Conference in Istanbul, Turkey, Nov. 2009.

Year

2009