$15.00
This paper covers the development of EPDM based cable splicing and filling compound designated as ‘Higel’ and its performance in a cable closure as a splicing compound. EPDM rubber was taken for the development of this new compound because is shows greater thermal and oxidative stability over conventional fillers. Comparative test results are given for two other fillers. (
This paper covers the development of EPDM based cable splicing and filling compound designated as ‘Higel’ and its performance in a cable closure as a splicing compound. EPDM rubber was taken for the development of this new compound because is shows greater thermal and oxidative stability over conventional fillers. Comparative test results are given for two other fillers. (
| Author(s) | Viswanathan, P.Hindustan Cables Ltd., Balasubramanian, S.Vasudevan, M. |
|---|---|
| Publication/Event/Pages | Wire Journal International18(7): 61-64, 67 1985, Paper presented at WAI 54th Annual Convention, Baltimore, MD, USA |
| Year | 1985 |
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