Development of fracture prediction technology during Cu fine-wire drawing

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Optimized die angle and pass schedule for the minimization of fracture and drawing force during Cu fine wire drawing have been suggested by FEM analysis. During Cu fine wiredrawing, it has been reported that fracture inherently takes place by central burst, rigid particle and back tension stress. In the present study, the occurrence of fracture was precisely predicted by Finite Element Analysis, minimizing the fracture through optimized determination of reduction in area (%) and angle, approach and entrance angles. With the current analysis procedure, the drawing die was design optimized and tested for practical application.

Description

Optimized die angle and pass schedule for the minimization of fracture and drawing force during Cu fine wire drawing have been suggested by FEM analysis. During Cu fine wiredrawing, it has been reported that fracture inherently takes place by central burst, rigid particle and back tension stress. In the present study, the occurrence of fracture was precisely predicted by Finite Element Analysis, minimizing the fracture through optimized determination of reduction in area (%) and angle, approach and entrance angles. With the current analysis procedure, the drawing die was design optimized and tested for practical application.

Additional information

Author(s)

Hoon Cho and Hyung-ho Jo, Korea Institute of Industrial Technology, and Byung-min Kim, Pusan National University, Korea.

Publication/Event/Pages

Paper presented at WAI 71st Annual Convention, Atlanta, GA, USA

Year

2001