$15.00
This paper presents the effect on the structure of adhesion interface and adhesion strength of the Sn content of bead wire and of compound types. The clean adhesion interlayer was successfully obtained by non-contact method, i.e. inserting a small gap between wire and rubber during vulcanization. Adhesion interface was analyzed by SEM, XPS, and XRD of Synchrotron (Pohang light source).
This paper presents the effect on the structure of adhesion interface and adhesion strength of the Sn content of bead wire and of compound types. The clean adhesion interlayer was successfully obtained by non-contact method, i.e. inserting a small gap between wire and rubber during vulcanization. Adhesion interface was analyzed by SEM, XPS, and XRD of Synchrotron (Pohang light source).
| Author(s) | Song Seong-Hun and Ban Deok-Young, Kiswire R&D Center, and Cho Kil-Won, Pohang University of Science and Technology (POSTECH), South Korea |
|---|---|
| Publication/Event/Pages | Paper presented at WAI's 79th Annual Convention (Interwire) in Cleveland, April, 2009. Published in WJI, March 2010, pp. 142-145. |
| Year | 2009 |
The Wire Association International, Inc., 71 Bradley Road, Suite 9, Madison, CT 06443-2662
Phone: (203) 453-2777
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
Copyright © 2025 The Wire Association International, Inc. All Rights Reserved
