$15.00
Increased use of high-speed electroplating equipment in the electronics industry has necessitated changes in tin and tin-lead alloy electrolytes to meet both growing production demands and tightening end use specifications. Problems encountered by the process engineer in meeting these demands are described along with solutions such as tin and tin alloy electroplating processes based upon fluoboric acid and those based upon sulfonic acid.
Increased use of high-speed electroplating equipment in the electronics industry has necessitated changes in tin and tin-lead alloy electrolytes to meet both growing production demands and tightening end use specifications. Problems encountered by the process engineer in meeting these demands are described along with solutions such as tin and tin alloy electroplating processes based upon fluoboric acid and those based upon sulfonic acid.
| Author(s) | F.I. Nobel, D. Schram, J.L. Martin and D. Thomson, LeaRonal, Inc., U.S.A. |
|---|---|
| Publication/Event/Pages | Paper presented at WAI 57th Annual Convention, Atlanta, GA USA |
| Year | 1987 |
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