$15.00
Copper wire is coated with tin to improve the solderability of the coated wire in electronics assemblies. Manufacturing techniques used may cause the formation of intermetallic compounds that interfer with the solderability. A method is described whereby intermetallic layers formed may be identified and in some cases quantified. Ways of dealing with the problem are described.
Copper wire is coated with tin to improve the solderability of the coated wire in electronics assemblies. Manufacturing techniques used may cause the formation of intermetallic compounds that interfer with the solderability. A method is described whereby intermetallic layers formed may be identified and in some cases quantified. Ways of dealing with the problem are described.
| Author(s) | Norbert Sajdera, Kocour Company, U.S.A. |
|---|---|
| Publication/Event/Pages | Paper presented at WAI 57th Annual Convention, Atlanta, GA USA |
| Year | 1987 |
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