$15.00
In this study, the effects of the rake angle of the die used for scalping and the scalping depth are examined to obtain wires with high surface quality. The results indicate that the surface quality of the wire deteriorates at a high level of scalping. To remove defects, although their complete removal is necessary, the scalping depth should be as small as possible. The amount of scalping is varied in experiments to identify the optimum scalping conditions.
In this study, the effects of the rake angle of the die used for scalping and the scalping depth are examined to obtain wires with high surface quality. The results indicate that the surface quality of the wire deteriorates at a high level of scalping. To remove defects, although their complete removal is necessary, the scalping depth should be as small as possible. The amount of scalping is varied in experiments to identify the optimum scalping conditions.
| Author(s) | Kazunari Yoshida and Koichiro Tanabe, Tokai University, Japan |
|---|---|
| Publication/Event/Pages | Paper presented at WAI's 78th Annual Convention (Wire Expo) in Pittsburgh, June, 2008. Published in WJI, July 2009, pp. 72-76. |
| Year | 2008 |
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