$15.00
The paper gives a brief introduction to induction heating principles and specific applications for wire heat including the Radyne Hi-bond<190> process for PC wire, diffusion, annealing, low relaxation, hardening and tempering, and heating for the removal of solvents.
The paper gives a brief introduction to induction heating principles and specific applications for wire heat including the Radyne Hi-bond<190> process for PC wire, diffusion, annealing, low relaxation, hardening and tempering, and heating for the removal of solvents.
| Author(s) | Kelvin D. Spain and Bob Kirkwood, Radyne Corp., USA |
|---|---|
| Publication/Event/Pages | Paper presented at WAI 65th Annual Convention, Atlanta, GA USA. Paper published in Wire Journal International, Feb. 1997, pg. 220. |
| Year | 1995 |
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