Manufacturing of High-Strength and High-Ductility Tough-Pitch Copper Wire by Alternate Wiredrawing

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This paper proposes that the alternate wiredrawing method markedly improves the ductility of a nonferrous metal wire. This method makes it possible to produce high-ductility wire due to its ability to inhibit the additional shearing strain near the wire surface. The increase in ductility was confirmed by comparison of mechanical properties and FEA results between conventional and alternately drawn wires, which proves the possibility of production of high-ductility nonferrous wires.

SKU: P05644 Category:

Description

This paper proposes that the alternate wiredrawing method markedly improves the ductility of a nonferrous metal wire. This method makes it possible to produce high-ductility wire due to its ability to inhibit the additional shearing strain near the wire surface. The increase in ductility was confirmed by comparison of mechanical properties and FEA results between conventional and alternately drawn wires, which proves the possibility of production of high-ductility nonferrous wires.

Additional information

Author(s)

Kazunari Yoshida, Hidetoshi Nagashima, and Shintaro Takamiya, Tokai University

Publication/Event/Pages

Interwire

Year

2017