$15.00
A dynamic measurement technique for measuring stress relaxation of small diameter wire was developed. The effects of stress relief and processing history were evaluated using this technique. Nonferrous high performance copper alloys were used to conduct this study.
A dynamic measurement technique for measuring stress relaxation of small diameter wire was developed. The effects of stress relief and processing history were evaluated using this technique. Nonferrous high performance copper alloys were used to conduct this study.
| Author(s) | Jim L. Johnson, Brush Wellman, Inc., and Dr. Patrick Flanagan, Cleveland State University, USA |
|---|---|
| Publication/Event/Pages | Paper presented at WAI 68th Annual Convention, Cleveland, OH USA. Paper published in Wire Journal International, Feb. 1999, pg. 82. |
| Year | 1998 |
The Wire Association International, Inc.
71 Bradley Road, Suite 9
Madison, CT 06443-2662
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
Copyright © 2025 The Wire Association International, Inc. All Rights Reserved
