$15.00
A flaw removing technique and a flaw removing device based on a centerless peeling machine system is described for the detection of wire rod surface defects. Major specifications of the machine, operational data on the machine, and effects on product quality are considered.
A flaw removing technique and a flaw removing device based on a centerless peeling machine system is described for the detection of wire rod surface defects. Major specifications of the machine, operational data on the machine, and effects on product quality are considered.
| Author(s) | Imiya, T.Kobe Steel Ltd, Kumasaki, T.Nishi, S.Kawaguchi, Y.Marukawa, N.Kontani, Y. |
|---|---|
| Publication/Event/Pages | Wire Journal International14(4): 66-72 1981, Paper presented at WAI 3rd European Regional Meeting, Bruges, Belgium |
| Year | 1981 |
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The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
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