$15.00
The following new developments will be presented: Film-foam-skin process to improve the adhesion of the conductors; influence of backtwist on conductors and pairs; S-Z cabling of pairs; manufacturing cell concept; and cable testing up to 1000 MHz.
The following new developments will be presented: Film-foam-skin process to improve the adhesion of the conductors; influence of backtwist on conductors and pairs; S-Z cabling of pairs; manufacturing cell concept; and cable testing up to 1000 MHz.
| Author(s) | Edgar Gauder, Gauder Group, Belgium, and Christian Montusclat, Setic, France |
|---|---|
| Publication/Event/Pages | Paper presented at WAI 68th Annual Convention, Cleveland, OH USA |
| Year | 1998 |
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The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
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