Description
Studies of diffusion, formation of intermetallic compounds, spontaneous whisker growth and annealing characteristics of core material, and plating conditions have resulted in the development of new types of lead wire. Several new types of lead wire (silver plated copper and copper alloy, solder plated or tin plated copper, and nickel plated copper) and their applications are discussed. A new plating bath for solder and tin is also considered. The importance of undercoat is emphasized.
