$15.00
A semi-conductive powder developed for application to power cables is presented. Characteristics of the powder, cohesive mechanisms, polishing mechanisms, melting mechanisms, the manufacturing process, and various applications are considered. Data are included on shear strength and electrical resistance.
A semi-conductive powder developed for application to power cables is presented. Characteristics of the powder, cohesive mechanisms, polishing mechanisms, melting mechanisms, the manufacturing process, and various applications are considered. Data are included on shear strength and electrical resistance.
| Author(s) | Maki, S.Sumitomo Electric Industries Ltd., Takemoto, Y.Osawa, S.Horikawa, T.Toa Gosei Chemical Industrial Co. Ltd. |
|---|---|
| Publication/Event/Pages | Wire Journal International14(11): 86-91 1981, Paper presented at WAI 50th Annual Convention, Cincinnati, OH USA |
| Year | 1981 |
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