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Processes involved in the silver plating of copper wire are discussed. Steps in the process include cleaning, low tension electroplating, and winding of the wire. Methods for regulating deposit thickness are explained, formulas are presented, the factors to be considered in precision drawing are discussed.
Processes involved in the silver plating of copper wire are discussed. Steps in the process include cleaning, low tension electroplating, and winding of the wire. Methods for regulating deposit thickness are explained, formulas are presented, the factors to be considered in precision drawing are discussed.
| Author(s) | Presented |
|---|---|
| Publication/Event/Pages | Wire & Wire Products3(12): 410-411, 421-423 1928 |
| Year | 1928 |
The Wire Association International, Inc.
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The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
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