$15.00
The development and application of a thin, rosin cored solder strip and a low tin solder for Stalpeth cable production are discussed. Application of round solder wire, rolled solder strip factors, low tin solder alloy, low tin-antimony solder, and results of metallurgical studies are considered.
The development and application of a thin, rosin cored solder strip and a low tin solder for Stalpeth cable production are discussed. Application of round solder wire, rolled solder strip factors, low tin solder alloy, low tin-antimony solder, and results of metallurgical studies are considered.
| Author(s) | Padowicz, H.N., Bell Telephone Labs Inc. |
|---|---|
| Publication/Event/Pages | Wire & Wire Products38(6): 813-816, 872-874 |
| Year | 1963 |
The Wire Association International, Inc.
71 Bradley Road, Suite 9
Madison, CT 06443-2662
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
Copyright © 2025 The Wire Association International, Inc. All Rights Reserved
