$15.00
A discussion of some basic principles of the continuous electroplating of wire is presented. Variables such as plating current, density of deposited material, radius of wire, thickness of deposit, and lineal speed of wire, which can be treated mathematically to describe and predict electroplating, are considered.
A discussion of some basic principles of the continuous electroplating of wire is presented. Variables such as plating current, density of deposited material, radius of wire, thickness of deposit, and lineal speed of wire, which can be treated mathematically to describe and predict electroplating, are considered.
| Author(s) | Ashton, A.B.Frederick *Smith & Co Ltd. |
|---|---|
| Publication/Event/Pages | Wire & Wire Products30(10): 1163-1166, 1293-1294 1955, Paper presented at WAI 25th Annual Convention, Chicago, IL USA |
| Year | 1955 |
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The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
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