Texture development in copper wire

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A basic discussion of texture (preferred grain orientation) in copper wire is set forth, including the roles of deformation and annealing, methods of characterization, practical significance, and related process variables and process optimization. Recent work by Kraft et al., on the relation of die angle to texture and annealing response is summarized, and the implications for processing for minimization of elastic springback are examined.

Description

A basic discussion of texture (preferred grain orientation) in copper wire is set forth, including the roles of deformation and annealing, methods of characterization, practical significance, and related process variables and process optimization. Recent work by Kraft et al., on the relation of die angle to texture and annealing response is summarized, and the implications for processing for minimization of elastic springback are examined.

Additional information

Author(s)

Roger N. Wright, Rensselaer Polytechnic Institute, USA.

Publication/Event/Pages

Paper presented at WAI 66th Annual Convention, Charlotte, NC USA. Paper published in Wire Journal International, April 1997, pg. 70.

Year

1996