The effect of thermal expansion of dies on dimensional accuracy in drawn bar and wire

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This paper focuses on the effect of thermal expansion of the die diameter during drawing of bar and wire. It was found that as the temperature of the die increased, the diameter of the bar also increased. For example, when the temperature of the die interface in contact with the material increased from room temperature to 180°C, the diameter of the bar increased to 0.2% of the die diameter. It was confirmed that temperature control of the die was effective in achieving a constant dimensional accuracy in drawn bar and wire.

SKU: P05277 Category:

Description

This paper focuses on the effect of thermal expansion of the die diameter during drawing of bar and wire. It was found that as the temperature of the die increased, the diameter of the bar also increased. For example, when the temperature of the die interface in contact with the material increased from room temperature to 180°C, the diameter of the bar increased to 0.2% of the die diameter. It was confirmed that temperature control of the die was effective in achieving a constant dimensional accuracy in drawn bar and wire.

Additional information

Author(s)

Ryosuke Komami, Motoo Asakawa, Satoshi Kajino, and Hiroaki Kubota, Waseda University, Japan

Publication/Event/Pages

Paper presented at WAI's 77th Annual Convention (Interwire) in Cleveland, May, 2007. Published in WJI, July 2008, pp. 68-73.

Year

2007