The effects of wire bar composition on the annealing properties of copper wire

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Experiments were designed to determine the effects of the impurities antimony, bismuth, lead, tellurium, and selenium on the annealing behavior of copper and on electrical conductivity and wiredrawing performance. Conductivity and wiredrawing performance were not affected by the impurities in the ranges studied, but some effects on annealability are described.

Description

Experiments were designed to determine the effects of the impurities antimony, bismuth, lead, tellurium, and selenium on the annealing behavior of copper and on electrical conductivity and wiredrawing performance. Conductivity and wiredrawing performance were not affected by the impurities in the ranges studied, but some effects on annealability are described.

Additional information

Author(s)

Reese, D.A.Kennecott Copper Corp., Western Electric Co. Inc., Condra, L.W., General Cable Corp.

Publication/Event/Pages

Wire Journal2(7): 42-50 1969, Paper presented at WAI 38th Annual Convention, Riderwood, MD USA

Year

1969