$15.00
The influence of impurities on the annealability of electrolytic tough pitch copper is discussed, and a model to predict annealability based upon chemical analysis is presented. Levels of nine impurity elements were determined by spectrographic means. Annealability was assessed by the General Electric method. Multiple regression analysis was used to analyze the data; the results are presented in tabular form.
The influence of impurities on the annealability of electrolytic tough pitch copper is discussed, and a model to predict annealability based upon chemical analysis is presented. Levels of nine impurity elements were determined by spectrographic means. Annealability was assessed by the General Electric method. Multiple regression analysis was used to analyze the data; the results are presented in tabular form.
| Author(s) | Hallam, D.C.Wyre Wynd Inc., Southwire Co., General Cable Corp., General Electric Co. |
|---|---|
| Publication/Event/Pages | Wire Journal10(9): 115-118 1977, Paper presented at WAI Nonferrous/Electrical Divisional Meeting, Cherry Hill, NJ USA |
| Year | 1977 |
The Wire Association International, Inc.
71 Bradley Road, Suite 9
Madison, CT 06443-2662
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
Copyright © 2025 The Wire Association International, Inc. All Rights Reserved
