Thermal analysis of new optical cable filling and flooding compounds

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A comparison of the PE/PJ, ETPR and gelled oil based filling and flooding compounds was undertaken using dynamic mechanical analysis and thermal analysis. The coefficient of thermal expansion using a quartz dilatometer was used to measure the void formation tendency of the filling/flooding compound upon cooling after heated transfer into the optical cable. It was found that the expansion coefficients of the materials decrease in the order PE/PJ.

Description

A comparison of the PE/PJ, ETPR and gelled oil based filling and flooding compounds was undertaken using dynamic mechanical analysis and thermal analysis. The coefficient of thermal expansion using a quartz dilatometer was used to measure the void formation tendency of the filling/flooding compound upon cooling after heated transfer into the optical cable. It was found that the expansion coefficients of the materials decrease in the order PE/PJ.

Additional information

Author(s)

Michael T. Costello, Alan D. Eckard and William J. Thalman, Witco Corp., USA

Publication/Event/Pages

Paper presented at WAI 68th Annual Convention, Cleveland, OH USA. Paper published in Wire Journal International, March 1999, pg. 258.

Year

1998