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An ultrasonic soldering method by which it is practical to eliminate the flux from most solder-joining operations is presented. Mechanical oxide dispersal, equipment used, modifications, accessories, automation, and advantages of ultrasonic soldering are discussed. Three case studies are presented.
An ultrasonic soldering method by which it is practical to eliminate the flux from most solder-joining operations is presented. Mechanical oxide dispersal, equipment used, modifications, accessories, automation, and advantages of ultrasonic soldering are discussed. Three case studies are presented.
| Author(s) | Denslow, C.A.Branson Sonic Power Co. |
|---|---|
| Publication/Event/Pages | Wire Journal9(9): 131-136 1976, Paper presented at WAI 45th Annual Convention, Washington, DC USA |
| Year | 1976 |
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