$15.00
The need to increase productivity and reduce waste is critical. Better measurement of the product provides the edge necessary to achieve that goal. Revolutionary holographic, non-contact diameter measurement technology with scan rates three to five times greater than older technology can be used for flaw detection and minimum, maximum and average diameter measurements.
The need to increase productivity and reduce waste is critical. Better measurement of the product provides the edge necessary to achieve that goal. Revolutionary holographic, non-contact diameter measurement technology with scan rates three to five times greater than older technology can be used for flaw detection and minimum, maximum and average diameter measurements.
| Author(s) | Les Jenson and Brent Kiser, TSI Inc., USA. |
|---|---|
| Publication/Event/Pages | Paper presented at WAI 73rd Annual Convention, Atlanta, GA USA |
| Year | 2003 |
The Wire Association International, Inc.
71 Bradley Road, Suite 9
Madison, CT 06443-2662
The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
Copyright © 2025 The Wire Association International, Inc. All Rights Reserved
