Wiredrawing process in heated die applied for low deformable biocompatible magnesium alloys

Wiredrawing process in heated die applied for low deformable biocompatible magnesium alloys

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This paper investigates the drawing of thin wire of biocompatible magnesium alloys in a die heated to about 300°C. The purpose is to carry out drawing in conditions in which recrystallization occurs and the drawn wire does not break. Based on an FEM drawing model and models of yield stress and ductility, the relationship between technological parameters of drawing and fracture parameters was obtained. Maps were developed of possible elongation for MgCa0.8 and Ax30 magnesium alloys. The result was thin wires from magnesium alloys with diameters 0.1 mm.

SKU: P05494 Category:

Description

This paper investigates the drawing of thin wire of biocompatible magnesium alloys in a die heated to about 300°C. The purpose is to carry out drawing in conditions in which recrystallization occurs and the drawn wire does not break. Based on an FEM drawing model and models of yield stress and ductility, the relationship between technological parameters of drawing and fracture parameters was obtained. Maps were developed of possible elongation for MgCa0.8 and Ax30 magnesium alloys. The result was thin wires from magnesium alloys with diameters 0.1 mm.

Additional information

Author(s)

Andriej Milenin and Piotr Kustra, AGH University of Science and Technology, Poland
Publication/Event/Pages

Paper published in Conference Proceedings for WAI's 82nd Annual Convention (Operations Summit) in Dallas, May 2012.
Year

2012

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