$15.00
The usual commercial method used to measure thickness of surface oxide film on copper is based upon coulometric reduction principles. In this production test, inaccuracies and anomalies may result from higher current, oxygen in the electrolyte, oxides in cracks and residual lubricant. These influences are evaluated by comparison with ellipsometry analysis and will be discussed along with a method for automation.
The usual commercial method used to measure thickness of surface oxide film on copper is based upon coulometric reduction principles. In this production test, inaccuracies and anomalies may result from higher current, oxygen in the electrolyte, oxides in cracks and residual lubricant. These influences are evaluated by comparison with ellipsometry analysis and will be discussed along with a method for automation.
| Author(s) | Gil Baker and Horace Pops, Essex Group, Inc., USA |
|---|---|
| Publication/Event/Pages | Paper presented at WAI 68th Annual Convention, Cleveland, OH USA. Paper published in Wire Journal International, Feb. 1999, pg. 90. |
| Year | 1998 |
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