$15.00
Scanning electron microscopy and 3D photography are used to evaluate super fine and ultra fine copper wire breaks. Metal flow characteristics of the fracture area are distinguished by observing the depth factor of the wire break. Classifications of individual wire breaks, and problem analysis’ are given.
Scanning electron microscopy and 3D photography are used to evaluate super fine and ultra fine copper wire breaks. Metal flow characteristics of the fracture area are distinguished by observing the depth factor of the wire break. Classifications of individual wire breaks, and problem analysis’ are given.
| Author(s) | Chia, E.H.Southwire Co., USA |
|---|---|
| Publication/Event/Pages | Wire Journal International15(7): 96-102 1982, Paper presented at WAI 51st Annual Convention, Atlanta, GA USA |
| Year | 1982 |
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The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry.
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