Insoluble anodes for pyrophosphate copper electroplating

$15.00

A novel method to maintain the chemical composition of a pyrophosphate plating solution when using insoluble anodes is described. The system utilizes an auxiliary electrochemical replenishment cell with an ion exchange membrane for the replenishment of copper ions in the plating solution. Wire plating, system performance, and process benefits are discussed.

Description

A novel method to maintain the chemical composition of a pyrophosphate plating solution when using insoluble anodes is described. The system utilizes an auxiliary electrochemical replenishment cell with an ion exchange membrane for the replenishment of copper ions in the plating solution. Wire plating, system performance, and process benefits are discussed.

Additional information

Author(s)

T. W. Starinshak and G. P. Wood, Goodyear Tire & Rubber Co., USA.

Publication/Event/Pages

Paper presented at WAI 64th Annual Convention, Detroit, MI USA. Paper published in Wire Journal International, Oct. 1994, pg. 90.

Year

1994