The state of the art of saw wire process technology

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Saw wire is mainly used for cutting polycrystalline silicon ingots into wafers which are applied in photovoltaic panels. A strong growing market requires the highest demands of saw wire technology. Diameters between 0,06 and 0,12 mm and tensile strength in the range of 4.000 to 5.000 N/mm² belongs to the group of high-carbon wires. The product requires a super clean steel, a consistent patenting and brass plating technology, and a special fine wire drawing process.

SKU: P05512 Category:

Description

Saw wire is mainly used for cutting polycrystalline silicon ingots into wafers which are applied in photovoltaic panels. A strong growing market requires the highest demands of saw wire technology. Diameters between 0,06 and 0,12 mm and tensile strength in the range of 4.000 to 5.000 N/mm² belongs to the group of high-carbon wires. The product requires a super clean steel, a consistent patenting and brass plating technology, and a special fine wire drawing process.

Additional information

Author(s)

Wolfgang Weidenhaupt, Metcore Stahltechnik GmbH, Germany

Publication/Event/Pages

Paper presented at WAI's 83rd Annual Convention (Interwire) in Atlanta, April 2013.

Year

2013