Description
The use of wireform construction for packaging of electronic equipment by Tektronix Inc is discussed. Advantages, disadvantages, system engineering, and design constraints are considered.
Wireform construction for electronic instrument packaging
$15.00
The use of wireform construction for packaging of electronic equipment by Tektronix Inc is discussed. Advantages, disadvantages, system engineering, and design constraints are considered.
Additional information
| Author(s) | Saucy, T.Tektronix Inc. |
|---|---|
| Publication/Event/Pages | Wire Journal11(9): 163-165 1978 |
| Year | 1978 |
